There are many standards in the PCB industry, and what do you know about the common PCB standards? For reference:

1) ipc-esd-2020: joint standard for the development of electrostatic discharge control program. This includes the design, establishment, implementation and maintenance of the electrostatic discharge control program. According to the historical experience of some military and commercial organizations, it provides guidance for the treatment and protection of electrostatic discharge in sensitive period.

2) ipc-sa-61a: semi-water cleaning manual after welding. This includes all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, process, process control and environmental and safety considerations.

3) ipc-ac-62a: manual for water cleaning after welding. Describe manufacturing residue, the types and properties of aqueous cleaner, water into a cleaning process, equipment and processes, quality control, environmental control and the safety of employees and the cost of the test of cleanliness and.

4) ipc-drm-40e: desktop reference manual for evaluation of through-hole welding points. Detailed description of components, hole walls, and soldering surfaces as required by the standards, in addition to computer-generated 3D graphics. It covers tin filling, contact Angle, tinning, vertical filling, pad covering and numerous soldering defects.

5) ipc-ta-722: welding technology assessment manual. Include all aspects of welding technology of 45 articles, content involves ordinary welding materials, welding, manual welding, batch, wave soldering, reflow soldering, welding the weld and infrared gas phase.

35 standard summary of PCB

6) ipc-7525: template design guide. For the solder paste and surface-mount adhesive coating templates provide guidelines to design and manufacture of the I also discussed the application of template design of surface-mount technology, and introduces the hole or flip chip components with you? Kunhe technology, including overprinting, double printing and stage template design.

7) IPC/ eiaj-std-004: specification requirements for flux including appendix I. Organic and inorganic flux which includes technical indexes and classification of rosin and resin and is classified according to the halogen content and activation degree of the flux; Also included are the use of flux AIDS, substances containing flux AIDS, and low residue flux residues used in cleaning free processes.

8) IPC/ eiaj-std-005: specification requirements of solder paste including appendix I. The characteristics and technical specifications of solder paste are listed, including test methods and metal content standards, as well as viscosity, collapse, solder ball, viscosity and solder paste tinning performance.

9) IPC/ eiaj-std-006a: specification requirements for electronic grade solder alloys, flux AIDS and non-flux solid solder. For electronic grade solder alloy, bar, strip, powdered flux and the flux of the solder, for the application of electronic soldering, offer special electronic grade solder term name, specification requirements and test methods.

10) ipc-ca-821: general requirements for heat-conducting binder. This includes the requirement and test method for bonding components to a suitable thermal conductive medium.

11) ipc-3406: guide for coating adhesive on conductive surface. It provides guidance for the choice of conductive binder as an alternative for soldering tin in electronic manufacturing.

12) ipc-aj-820: assembly and welding manual. Includes description of inspection techniques for assembly and welding, including terms and definitions; Specification reference and outline of the types of printed circuit boards, components and pins, materials for welding points, installation and design of components and components; Welding technology and packaging; Cleaning and coating; Quality assurance and testing.

13) ipc-7530: guide to temperature curve of batch welding process (reflow welding and wave soldering). Various testing methods, techniques and methods are used in temperature curve acquisition to provide guidance for the establishment of the best graph.

14) ipc-tr-460a: troubleshooting list of wave soldering failure of printed circuit board. A list of recommended corrective actions for possible failure due to peak welding.

15) the IPC/EIA/JEDECJ - STD - 003 - a. Test the weldability of printed circuit board.

16) j-std-013: application of spherical lattice point array encapsulation (SGA) and other high-density technologies. Establish specifications and requirements needed for the printed circuit board assembly process and interaction, for high performance and high pin number integrated circuit packaging interconnection to provide information, including the design principle of information, the choice of materials, the board manufacturing and assembly technology, test method, and based on the reliability of the end-use environment.

17) ipc-7095: design and assembly of SGA devices. Provide a variety of useful operational information to people who are using SGA devices or who are considering switching to array encapsulation; Provide guidance for SGA testing and maintenance and provide reliable information about SGA field.

18) ipc-m-i08: cleaning instruction manual. This includes the latest version of IPC cleaning instructions to help manufacturing engineers determine product cleaning processes and troubleshooting.

Ipc-ch-65-a: cleaning guide for PCB assembly #e#19) ipc-ch-65-a: cleaning guide for PCB assembly. Made in the electronics industry, based on current and new cleaning method for reference, including descriptions of all kinds of cleaning methods and discuss, explained in the manufacturing and assembly operations of various materials, process and the relationship between the pollutant.

20) ipc-sc-60a: manual for cleaning solvent after welding. The application of solvent cleaning technology in automatic welding and manual welding is presented. The properties, residues, process control and environmental problems of solvent are discussed.

21) ipc-9201: surface insulation resistance manual. Includes the terms, theories, test procedures and test methods of surface insulation resistance (SIR), as well as temperature, humidity (TH) tests, failure modes and troubleshooting.

22) ipc-drm-53: introduction of the desktop reference manual for electronic assembly. Drawings and photographs showing through hole mounting and surface mounting techniques.

23) ipc-m-103: standard for surface mounting assembly manual. This section includes all 21 IPC files related to surface mounting.

24) ipc-m-i04: standard for PCB assembly manual. Contains 10 of the most widely used documents relating to PCB assembly.

25) ipc-cc-830b: performance and identification of electronic insulation compounds in PCB assembly. The protective coating meets an industrial standard of quality and qualification.

26) ipc-s-816: surface mount technical process guide and list. The troubleshooting guide lists all types of technical problems encountered in surface mount assembly and their solutions, including bridging, leaky welding, and uneven placement of components.

27) ipc-cm-770d: installation guide for PCB components. For printed circuit board assembly of components to provide effective guidance, and reviews the relevant standards, the influence and distribution situation, including assembly technology (including manual and automatic and surface-mount technology and flip chip assembly technology) and considering the follow-up welding, cleaning and laminating process.

28) ipc-7129: calculation of the number of failures (DPMO) per million opportunities and production indicators for PCB assembly. Agreed benchmarks for calculating defects and quality related industrial sectors; It provides a satisfactory method for calculating the benchmark index of the number of failures per million.

29) ipc-9261: production estimates of PCB assemblies and failures occurring every million times during assembly. A reliable method is defined to calculate the number of failures per million chance in PCB assembly.

30) ipc-d-279: reliable surface mount technology printed circuit board assembly design guide. Reliability manufacturing process guide for printed circuit board with surface mount technology and hybrid technology, including design ideas.

31) ipc-2546: combination requirements of transmission points in PCB assembly. Describes the material movement system, such as actuators and the placement of buffers, manual, automatic silk screen printing, adhesive automatic distribution, automatic SMT placement, automatic placement of plated through hole, forced convection, and infrared reflow oven and wave soldering.

32) ipc-pe-740a: troubleshooting during PCB manufacturing and assembly. Includes case records and calibration activities for problems in the design, manufacture, assembly and testing of printed circuit products.

33) ipc-6010: printed circuit board quality standards and performance specifications series manual. Including the American PCB association's quality and performance standards for all PCB.

34) ipc-6018a: inspection and testing of microwave finished printed circuit board. Includes high frequency (microwave) printed circuit board performance and qualification requirements.

35) ipc-d-317a: high speed electronic packaging design guide. Provides guidance for the design of high speed circuits, including mechanical and electrical considerations and performance testing.